3D NAND Design Enablement Lead

at Micron Technology, Inc. in Boise, Idaho, United States

Job Description

Micron Technology, Inc. has an opening for 3D NAND Design Enablement Lead in Boise, ID. 

Job Duties: Drive vertical integration with a network of stake holders varying from Business Units, Pathfinding, Design, Process, Integration, Reliability, Product Engineering, Probe, Test, Assembly, and mask tech. Drive node health tracking, communication and documentation of key milestones delivery starting from project kick off till product qual. Ensure all node enabling teams have responsible owner for each node. Collaborate with responsible owner to populate clear specifications in the database. Publish scorecards of deliverables from accountable owner in the health report. Create timeline charts to provide clear visibility of project timelines and relative dependencies across node enabling teams. Champion test structure definition for all designs within a node starting from test chip to final production design. Drive for high quality proliferation of test structures from test chip to product designs. Request TCAD, structure, OPC, electrical and reliability simulations. Ensure all test structures are validated on silicon and are readily available for product debug.

Requirements: Employer will accept a Bachelor’s degree in Electronics Engineering, Electrical Engineering, Physics, Material Science, Microelectronics or a related field and two years of experience in the job offered or in semiconductor-related occupation.

Contact:                       To apply, visit Search by requisition no. JR53449.

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Job Posting: 2218461

Posted On: Jun 04, 2024

Updated On: Jul 09, 2024

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