Engineer-Dry Etch-DRAM/EM

at Micron Technology, Inc. in Boise, Idaho, United States

Job Description

Micron Technology, Inc. has an opening for Engineer-Dry Etch-DRAM/EM in Boise, ID.

Duties: Design and optimize plasma etch processes for Micron's leading-edge memory. Work on plasma dry etch process characterization, optimization, design, troubleshooting, process transfer and fundamental research. Take ideas from conception through process development then implementation in our production facilities. Ensure robust etch processes that meet the precise physical and electrical requirements for Micron products. Update the Fab engineers on customer issues and technology needs. Support root cause defect and unique fail mode analysis. Deliver advanced technology to meet future product nodes. Develop recipes to meet structural & electrical requirements. Manage wafers though Dry Etch levels in support of specific requirements. Work in cross-functional teams to jointly develop CMOS structures. Support cross-functional failure analysis and yield improvement. Serve as a resource for peers in recipe & process development.

Position requires travel. May be assigned to various, unanticipated sites throughout U.S (United States). / May telecommute part-time.

Requirements: Employer will accept a Ph.D. degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, Nuclear Engineering or related field.

Contact: To apply, visit Search by requisition no. JR52529

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Job Posting: 2206252

Posted On: May 08, 2024

Updated On: Jun 12, 2024

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